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As a well-known LED packaging equipment supplier in China, Dazu Optoelectronics achieved leap-forward development last year, with a year-on-year increase of 337,%, which is much higher than the average growth rate of the industry. Not only that, the company officially launched the highest technical content of wire bonding machine products in the packaging equipment industry in 2010. "In addition to the company's existing SMD beam splitter, SMD tape loading machine, high-speed planar die bonding machine, Han's photoelectric has LED packaging. The supply capacity of the complete set of equipment." Hanry General Manager Henry told the Gaogong LED reporter. 
Equipment represents the level of development of the industry
The beautiful transcripts handed over last year made Henry feel pressure on this year's market expectations. "The market was really too hot last year. We expect to return to a rational growth level this year, meeting the average annual growth of 30%-50%. The growth target will follow the development of the packaging industry."
Market competition will undoubtedly become more and more fierce. Only by continuously improving product performance and developing new products can we cope with the increasingly fierce market. “The contribution of solid crystal machine and spectroscopic loading machine to turnover last year is the most important. We have these three models. The product has made some technical improvements and its performance has been significantly improved," Henry said.
Taking the loading machine as an example, from the end of last year to the beginning of this year, Dazu Optoelectronics invested resources in key research and development, and introduced high-speed models to the market. The production capacity has increased by 30%-50%, and the speed and stability have been greatly improved. .
At present, the market is generally optimistic about the key LED packaging equipment wire bonding machine that Dazu Optoelectronics put into production this year. Some commentators believe that this will greatly enhance the competitiveness of LED packaging equipment. Henry said that the wire bonding machine is the most complicated and technically high of all packaging equipment. The most technically demanding and demanding products, Dazu Optoelectronics has spent four years researching and developing. Currently, the wire bonding machine (HANS-5100) is mature and suitable for mass production, and its production capacity is three times higher than that of domestic manufacturers.
Henry is a native of the company and has extensive overseas experience. He believes that equipment is critical to the development of an industry. “Equipment is one of the most important factors in measuring whether a country or region can grasp an industry.†Henry believes that a country, no matter which industrial industry, is the last equipment, the highest technical content is the process corresponding to equipment and equipment. The industry competitiveness is finally reflected in the equipment. Solar energy is like this, and LEDs are like this, such as MOCVD equipment that everyone cares about, such as packaging equipment. 
Dazu Optoelectronics: Four Drivers Drive to Develop
2010 is a year of "explosive growth" in the global LED packaging equipment industry. Based on the rapid development of the LED packaging industry and the upgrading of fully automated equipment, the performance of most domestic LED packaging equipment manufacturers has doubled.