Fingerprint Lock Motor introduction:
Basic security work, lock body responsible for the security door lock body responsible for opening and closing lock, the lock body Lock Motor is of crucial importance.
Functions: it is widely used in various intelligent locks, such as Shared bicycle lock, fingerprint lock, glass lock, safe lock, hotel lock, family lock, inductive smart lock, etc
Features:Fingerprint Lock Motoris based on micro precision reducer development, small intelligent micro precision reducer can do 10 mm in diameter, is widely used in safe, locks, smart locks, sensor intelligent lock;
This kind of motor has the characteristics of low noise, low energy consumption, small volume, light quality, high precision, large torque and durability
Method of use: the best stable in horizontal plane, installed on the Fingerprint Lock Motoroutput shaft parts, cannot use a hammer to knock, knock prone to press into the dc Fingerprint Lock Motor drive, may cause damage to internal components, and cannot be used in the case of blocked.
Operating temperature range:
lock motor should be used at a temperature of -10~60℃.
The figures stated in the catalog specifications are based on use at ordinary room temperature catalog specifications re based on use at ordinary room temperature (approximately20~25℃.
If a lock motor is used outside the prescribed temperature range,the grease on the gearhead area will become unable to function normally and the motor will become unable to start.Depending on the temperature conditions ,it may be possible to deal with them by changing the grease of the motor's parts.Please feel free to consult with us about this.
Storage temperature range:
Fingerprint Lock Motor should be stored ta a temperature of -15~65℃.
In case of storage outside this range,the grease on the gearhead area will become unable to function normally and the motor will become unable to start.
Service life:
â—Use with a load that exceeds the rated torque
â—Frequent starting
â—Momentary reversals of turning direction
â—Impact loads
â—Long-term continuous operation
â—Forced turning using the output shaft
â—Use in which the permitted overhang load or the permitted thrust load is exceeded
â—A pulse drive ,e.g.,a short break,counter electromotive force,PWM control
â—Use of a voltage that is nonstandard as regards the rated voltage
â—Use outside the prescribed temperature or relative-humidity range,or in a special environment.
â—Please consult with us about these or any other conditions of use that may apply,so that we can be sure that you select the most appropriate model.
when it come to volume production,we're a major player as well .each month,we rurn out 600000 units,all of which are compliant with the rohs directive.Have any questions or special needed, please contact us, we have the engineer group and best sales department to service to you
Looking forward to your inquiry. Welcome to our factory.
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First, the chip material itself rupture phenomenon chip damage is greater than 1/5 of the width of the single-sided chip or the damage is at the oblique angle, each side is longer than 2/5 chip or damaged to the aluminum pad, such chips are not acceptable (this is the chip An item in the inspection standard). The main causes of the bad phenomenon are:
1. The chip manufacturer is not working properly
2. Chip incoming inspection has not been sampled
3. The solution was not picked out during online operation:
1. Inform the chip manufacturer to improve
2 Strengthen the feed inspection, and reject the chip with too much damage.
3. When the Q test is performed online, the broken chip should be picked out and the good chip should be added.
Second, the LED solid crystal machine is used improperly 1. The suction height of the machine and the height of the solid crystal are not directly controlled by the parameters of the computer. The parameters are large, the suction height is small; the parameters are small, the suction height is large, and the chip is damaged or not, which is directly affected by the suction height parameter of the machine. The main reasons for the bad phenomenon are: large parameters of the machine, low hunting height, excessive force on the chip, resulting in chip damage.
Solution:
Adjust the parameters of the machine, and appropriately increase the height of the nozzle or the height of the solid crystal. Adjust the height of the nozzle in the first “Pick Level†in the “Bond head menu†in the “SETUP†mode of the machine, and then in the second item. Bond Level" adjusts the solid crystal height.
2, the size of the nozzle does not match the size of the chip to be fixed with different nozzles. Large chips can be easily leaked with small nozzles and chips. Small chips can be easily broken with large nozzles and chips. Therefore, the selection of appropriate nozzles is a prerequisite for solid chips. The cause of the bad phenomenon is that the nozzle is too big to break the chip.
Solution: Choose the appropriate porcelain nozzle.
Third, artificial rupture caused by improper operation
A. Improper operation did not operate according to the regulations, so that the chip was broken. The main causes of the bad phenomenon are:
1. The material is not taken well and dropped to the ground.
2. When you enter the oven, you will encounter the chip. Solution: When taking the material, keep your hands steady. When entering the oven, the material should be flat and gently put in. Do not tilt or use excessive force.
B. The heavy object is damaged by the external force and the chip is broken. The main reasons for this kind of bad phenomenon are:
1. The microscope falls onto the material, breaking the chip
2. The machine parts are dropped onto the material.
3. Iron plate pressed to material solution:
1. The microscope screw should be locked
2. Regularly check the machine parts for looseness.
3. There must be no objects such as iron plates on the material.
Method for controlling and solving wafer cracking in LED solid crystal process
Single-electrode chips have very high requirements for solid crystal in the packaging industry. For example, in the LED production process, the quality of the solid crystal affects the quality of the finished LED products. There are many factors that cause LED solid crystal cracking. We only discuss the solution of LED solid crystal cracking from three factors: material, machine and man-made.