Infineon and ASE cooperate in the development and production cooperation of automotive product packaging

November 12, 2013- Infineon Technologies Co., Ltd. (Frankfurt Stock Exchange: IFX / U.S. OTC Stock Code: IFNNY) today announced that it is in partnership with Taiwan ’s ASE Semiconductor (abbreviated ASE, New York Stock Exchange stock code) : ASX, weighted index: 2311) A joint development and production agreement was reached for the assembly service of automotive products. The focus of this collaboration is to enable copper wire bonding and manufacturing in QFP (square flat) packages of automotive microcontrollers.

Peter Schaefer, vice president and general manager of Infineon Technologies ’automotive microcontroller business unit, said:“ Enable copper wire bonding in the QFP package of microcontrollers will further enhance our competitiveness in the automotive market. ASE has strong capabilities Manufacturing capacity and experience can meet the strict quality requirements of the automotive market; with the help of existing long-term partnerships, we can expand our existing QFP product portfolio to be suitable for future microcontrollers. "

One of the main drivers for the use of copper in the semiconductor industry is the rising cost of gold. From a cost perspective, copper wire bonding makes integrated circuit assembly more competitive. Copper also has excellent thermal and electrical conductivity. Since 2008, ASE Group has been at the forefront of manufacturing services for copper wire bonding components. To date, more than 25 billion copper wire IC packaging devices have been shipped.

"This cooperation statement is another milestone on the way of ASE Technology. The use of copper wire bonding in packaging used in the automotive market has always adhered to high quality assurance requirements," said Dr. Wu Tianyu, COO of ASE Group. Infineon ’s cooperation will provide ASE with the opportunity to learn and adopt the world-class standards of automotive semiconductor leaders. "

About ASE Group

ASE Group is the world's largest semiconductor manufacturing supplier, involving assembly, testing, materials, design and manufacturing. The semiconductor industry's increasing demand for faster, smaller, and higher-performance chips, as a global leader, in response to this trend, ASE Group has developed and launched a large number of technology and solution combinations, including integration Circuit test programming, front-end engineering testing, wafer probes, wafer bumps, substrate design and supply, wafer-level packaging, flip-chip, system-in-package, final testing, and electronic device manufacturing services (by Hualong Electric Co., Ltd.). ASE Group's sales reached US $ 6.5 billion in 2012, and it has more than 57,000 employees worldwide. For more information about ASE Group, please visit :.

About Infineon

Infineon Technologies AG, headquartered in Neubiberg, Germany, provides semiconductor and system solutions for the three major scientific and technological challenge areas of modern society—energy efficiency, mobility, and security. In fiscal year 2012 (as of September 30), the company achieved sales of 3.9 billion euros and had approximately 26,700 employees worldwide. Infineon Technologies has operations all over the world, with branches in Miupida, USA, Singapore, Asia-Pacific, and Tokyo, Japan. Infineon is currently listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and the U.S. over-the-counter market (OTCQX) InternaTIonal Premier (ticker symbol: IFNNY). More information can be found on the following website:.

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