Figure 1 Principle of high power LED chip for vertical structure design Unfinished Auto Identify Technology - The LENCENT multi usb plug charger would identify the connected devices intelligently and provide optimized charging universal compatibility. It`s suitable with electronic devices and models, from iPhones, Samsungs, HTC Nexus, Mp3 Players, Bluetooth Speaker Headsets to iPads and Power Devices Iphone Travel Charger Europe,Travel Charger Best,Travel Charger Dual Usb,Usb Travel Charger Dongguan City Leya Electronic Technology Co. Ltd , https://www.dgleya.com
In recent years, high-power LED lighting technology has achieved rapid development, especially the power and light-emitting efficiency of blue-light LED chips (including white LED chips) have been increasing, and the pace of LED lighting entering ordinary people's homes has become more and more clear. However, as the input power of the LED chip continues to increase, the requirement of large heat generation and high light output efficiency of the high power has put forward new and higher requirements for the heat dissipation performance of the LED chip. The selection of high-efficiency heat-dissipating substrate materials is an important solution to the high-power LED entering the lighting market.
The GaN light-emitting layer of the blue LED chip is usually obtained on a sapphire (Al2O3) substrate by MOCVD epitaxial growth technique. However, since sapphire has a low thermal conductivity and a thermal expansion coefficient that is far from that of GaN (as shown in Table 1), a large amount of participating shear stress is generated between the GaN layer and the sapphire layer during use. Directly causing cracks in the GaN layer, causing chip failure. The metal heat-dissipating substrate material has attracted more and more attention from foreign mainstream LED chip manufacturers due to its excellent characteristics such as low expansion, high thermal conductivity, and adjustable expansion coefficient.
For the fourth generation of LED chips, foreign mainstream LED chip manufacturers usually use the following two methods to solve the problems caused by the high power of the chip:
1. Vertical structure of the chip (as shown in Figure 1)
The design of the vertical structure of the chip on the metal substrate increases the heat dissipation capability of the LED chip itself, and increases the density of the light-emitting chip per unit area, thereby finally achieving the purpose of increasing the amount of light emitted. 
Table 1 Comparison of performance of various LED chip heat dissipation substrates
For more information, please refer to the October issue of "High-tech LED-Technology and Applications" 
High Speed Charging - Each port could offer maximum current up to 4.4A, fast-charging for any connected device efficiently, definitely you can charge 4 devices at the same time
Certified Safe - The certifications of EMC/LVD/ROHS make this travel plug a safety system with which would automatically stop charging once the devices are fully charged, or overheat, over-load, or short circuit
★Ideal for Travel - Portable Sized USB plug adapter with Interchangeable UK/USA/EU/AUS plugs and international voltage compatibility, makes it easy for multiple devices charging, anywhere you go (apply for type A / C / E / F / G / I )
New Metal Heat Dissipation Substrate--Solving High-Power LED Chip Cooling Solution
[Source: "High-tech LED - Technology and Applications" October issue]